Electronics and Circuit Card Assembly

A world class facility featuring state-of-the-art assembly & processing equipment and a flexible factory manufacturing system allows production of a diverse range of complex and technically demanding electronics and circuit card assemblies. The highly flexible manufacturing facility can accommodate both high and low volume manufacture with simultaneous trickle & surge production.

Facilities

The manufacturing facility features an automated screen print/pick & place/reflow line equipped with in-line automatic optical inspection, giving a production capability of tens of thousands of boards per annum.

Facilities include:

• Assembly of multi-chip modules (MCMs) and Ball Grid Arrays (BGAs)
• Chip scale packaging research
• Fully automated & computerised reflow solder system
• Integrated conveyors
• High volume forced nitrogen convection
• Lead-free compatibility
• Through-hole and mixed technology computerised wave soldering
• Selective soldering of double-sided circuit card assemblies and flexi-rigid assemblies using unique fixturing methods
• Component test on assembly (Flying Probe, Factron, Active Environmental Chamber)
• In-circuit passive tests (Direct CAD data test generation)
• High accuracy, high speed functional test
• Environmental stress screening